Flexible Replacement of Onboard Memory

Onboard memory offers great immunity against shock and vibration, but repairing is difficult and upgrade in the field is impossible. XR-DIMM memory module solves these shortcoming

This is an archive article published 08/26/2018. Some information may no longer be up to date and in line with the current state. Please contact us in case of interest.

As applications of memory in high vibration and shock environments are becoming more diverse, Apacer launched the latest rugged memory module XR-DIMM. Module with a high reliability and flexibility space usage in memory industry.

Rugged memory XR-DIMM uses the innovative board-to-board connector design to fit tightly and securely onto the motherboard. It adopts the highly durable 300-pin connector and mounting holes to effectively prevent memory modules from dislocating or coming away due to vibration or strong impact. This greatly improves the reliability of memory signal transmissions serving as the strongest support for applications.
"The market demands for rugged memory are on the rise; its applications in unmanned vehicles range from self-driving cars and smart IoV to defense and aerospace and intelligent logistics” claims Apacer

In the past, to deal with vibration and shock environments, onboard memories were utilized for better reliability. However, the traditional onboard memories have the disadvantages of:

  • upgradability, 
  • limited capacity,
  • performance,
  • tricky and costly to repair,
  • unable to stack, taking up more space on the motherboard. 

XR-DIMM’s design successfully solves the long-standing problems faced by traditional memory modules operating under special application environments. This also creates a new direction for the design of industrial computers’ motherboard.

Multiple Protection Technologies

The XR-DIMM’s sealed board-to-board connector is designed to cope with the severe environments of automotive electronics, avoiding the traditional memory’s gold finger’s problem of possible oxidation when exposed to outdoor contaminating environments its also usable in defense and aerospace fields.

XR-DIMM’s Underfill technology:

  • strengthens its anti-vibration ability and thermal shock resistance,
  • supports the guaranteed industrial grade Wide-Temp chips,
  • has a built-in thermal sensor to monitor the memory’s temperature, 
  • effectively preventing the memory module from overheating.

The Conformal Coating and Anti-Sulfuration technology ensure that the products can operate stably not only under humid and dusty environments but also environments where sulfur-containing gases pervade, providing a whole new option in industrial-grade memory.


picture 1.1 Rugged Memory Comparison

Apacer XR-DIMM’s connector design meets:

  • the anti-vibration,
  • the anti-shock standards / MIL-STD-810, ANSI/VITA 47-2005 /,
  • anti-humidity,
  • anti-dust,
  • anti-sulfuration,
  • high and low temperature resistant.

XR-DIMM is compatible with DDR4 2133/2400 specification, supports ECC function and comes in two capacity choices of 8 GB and 16 GB.

For further information about APACER products, please do not hesitate to contact us at apacer@soselectronic.com

Source : Apacer

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