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Manufacturer
QUECTEL
|
- | Bluetooth v5.3 | ADC, I2C, I2S, PWM, SPI, SWD, UART | 1,8 - 4,3VDC | 512Kbit | 15,0x12,0x2,25 mm | -40...+85°C | SMD | Yes | - | HCM111Z | MSL 3 |
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Manufacturer
QUECTEL
|
- | BLE 5.4 | ADC, I2C, I2S, PDM, PWM, SPI, USART | 1,71-3,8VDC | 512Kbit | 11,2x16,6x2,1mm | -40...+85°C | LCC | Yes | - | HCM511S | MSL 1 |
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Manufacturer
HOPERF
|
- | Bluetooth v4.0 | UART | 1,8 - 3,6VDC | - | 17x12,5x2 mm | -40...+125°C | SMD | Yes | - | - | MSL 3 |
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Manufacturer
HOPERF
|
- | Bluetooth v5.0 | UART | 1,8 - 3,6VDC | - | 17x12,5x2 mm | -40...+125°C | SMD | Yes | - | - | MSL 3 |
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Manufacturer
HOPERF
|
- | Bluetooth v5.0 | UART | 1,8 - 3,6VDC | - | 11,2x15,1x2,6 mm | -20...+85°C | SMD | Yes | - | - | MSL 3 |
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Manufacturer
FLAIRMESH
|
n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | - | - | n/a |
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Manufacturer
FLAIRMESH
|
Class 1 | Bluetooth v5.2 | GPIO, I2C, SPI, UART | 1,7 - 3,6VDC | - | 12x22x2,2 mm | -40...+85°C | SMD | Yes | - | - | n/a |
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Manufacturer
QUECTEL
|
n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | MSL 3 |
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Manufacturer
QUECTEL
|
n/a | BLE 5.4 | I2C, I2S, SPI, UART | n/a | n/a | 20x15,6x2,35 mm | n/a | n/a | n/a | - | HCM010 | MSL 3 |
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Manufacturer
QUECTEL
|
n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | n/a | MSL 3 |
|
Manufacturer
QUECTEL
|
- | Bluetooth v5.3 | ADC, I2C, I2S, PWM, SPI, SWD, UART | 1,8 - 4,3VDC | 512Kbit | 15,0x12,0x2,25 mm | -40...+85°C | SMD | Yes | - | HCM111Z | MSL 3 |
|
Manufacturer
QUECTEL
|
- | Bluetooth v5.3 | ADC, I2C, I2S, PWM, SPI, SWD, UART | 1,8 - 4,3VDC | 512Kbit | 15,0x12,0x2,25 mm | -40...+85°C | SMD | No | - | HCM111Z | MSL 3 |
|
Manufacturer
QUECTEL
|
- | BLE 5.4 | ADC, I2C, I2S, PDM, PWM, SPI, USART | 1,71-3,8VDC | 352Kbit | 11,2x16,6x2,1mm | -40...+85°C | LCC | Yes | - | HCM511S | MSL 1 |
|
Manufacturer
MICROCHIP
|
n/a | n/a | UART | n/a | n/a | 18x13,5x2 mm | n/a | n/a | n/a | - | ZigBit | n/a |
|
Manufacturer
MICROCHIP
|
n/a | n/a | UART | n/a | n/a | 18,8x13,5x2 mm | n/a | n/a | n/a | - | ZigBit | n/a |
|
Manufacturer
MICROCHIP
|
n/a | n/a | UART | n/a | n/a | 35x13,8x2 mm | n/a | n/a | n/a | - | ZigBit | n/a |
|
Manufacturer
MICROCHIP
|
n/a | n/a | SPI | n/a | n/a | 25x20x3,2 mm | n/a | n/a | n/a | - | ZigBit | n/a |
|
Manufacturer
MICROCHIP
|
- | Bluetooth v5.0 | I2C, SPI, UART | 1,9 - 3,6VDC | - | 12x22x2,4 mm | -40...+85°C | SMD | Yes | - | - | MSL 1 |
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Manufacturer
QUECTEL
|
n/a | - | - | n/a | n/a | - | n/a | n/a | n/a | - | - | MSL 3 |
|
Manufacturer
QUECTEL
|
n/a | - | Bluetooth, LCC | n/a | n/a | 16,5x13,3x2,3 mm | n/a | n/a | n/a | - | HC06 | MSL 3 |
|
Manufacturer
IMST
|
n/a | n/a | SPI, UART | n/a | n/a | 20x25x2,7 mm | n/a | n/a | n/a | - | iM222 | MSL 3 |
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Manufacturer
MICROCHIP
|
- | Bluetooth v4.1 | AIO, PIO, SPI, UART | 3,0 - 3,6VDC | - | 11,5x19,5x2,5 mm | -30...+85°C | SMD | Yes | - | - | n/a |
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Manufacturer
MICROCHIP
|
Class 1 | Bluetooth v4.1 | GPIO, I2C, SPI, UART | 1,8 - 3,6VDC | - | 11,5x19,5x2,5 mm | -30...+85°C | SMD | Yes | - | RN4020 | n/a |
|
Manufacturer
DIGI INTERNATIONAL
|
n/a | n/a | I2C, SPI, UART | n/a | n/a | 24,38x27,61 mm | n/a | n/a | n/a | - | Xbee 3 | n/a |
|
Manufacturer
DIGI INTERNATIONAL
|
n/a | n/a | I2C, SPI, UART | n/a | n/a | 24,38x27,61 mm | n/a | n/a | n/a | - | Xbee 3 | n/a |
Bluetooth modules are wireless communication modules that are used to transfer data between devices using Bluetooth technology. These modules enable wireless communication between devices such as smartphones, tablets, computers, headphones, speakers, and many others. Bluetooth modules can be integrated into devices such as wireless headphones, wireless speakers, smart watches, or fitness bracelets.
Bluetooth modules are used in many applications, such as wireless music playback, wireless connection to peripheral devices, or wireless data transfers between devices. These modules ensure easy and wireless connection between devices and make it easier for users to work with the functions of wireless devices.
