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QuecOpenTM from QUECTEL easily replaces the use of an external MCU in applications and uses the embedded processor resources instead. With the assistance of QuecOpenTM solution, hardware design and software design flow for wireless application will be simplified...
It is already here. Smartphones start to rule industrial applications. The most advanced IoT LTE module in the world has it all - LTE, BLE, WIFI, GNSS and Android OS.
What´s more, M66 is currently the smallest quad band GSM/GPRS moduloe in the world ... AT the same time it withstands strong frosts, so it´s ready for a wide spectrum of applications.
BC95 – ultra small size, ultra-low power consumption. As an authorized distributor and a major partner of Quectel, we are giving you the possibility to pre-order sample for free right now!
With the new MC60 Quectel breaks the dimension limits. The world smallest GSM/GNSS/Bluetooth combo module now is available for personal tracking devices.
Today more and more applications require high data rate transmission. LTE modules can be found not only e.g. in trucks but more and more vehicles are connected through LTE modules to the service centers and sends data for vehicle manufacturers to avoid damages and help new product development.
The common denominator of these seemingly unrelated numbers is Pizzaworkshop Quectel. 68 developers from the 4 countries met with representatives Quectel in 7 cities to have „hand on“ training with EC20 LTE modules.
Sometimes one picture can tell you more than thousand words. A big overwiev of all available QUECTEL GSM/3G/HSPA/LTE and GPS wireless modules:
Company Quectel brings to a market its first high-speed module EC20 which you can try yourself. More than fifty developers worked for over ten months on this module.
Quectel and M66 module were a hot topic for developers from 4 European countries in mid-May.
Thanks to the enhanced functionality of the M95 FA module, this new version can be used for even more applications.
Moreover, new UMTS/HSPA module Quectel UG95 is pin-compatible with 2G thus offering a simple way to migrate to 3G without a PCB redesign.