PICO-iMX6UL Kit is one of the first available boards that carries the Android Things logo.
This is an archive article published 03/29/2017. Some information may no longer be up to date and in line with the current state. Please contact us in case of interest.
Android Things is a turnkey solution that provides certified hardware for the creation of IoT devices. Developers can continue to use familiar tools and APIs such as Android Studio, the Android SDK, and Google Play services. In the future, Android Things will be updated to include infrastructure for the installation of updates, Weave - a communication protocol that enables both local and cloud connectivity via multiple wireless protocols and more.
Android Things is only in a preview state at the moment, however sufficient portion of the final operating system is already working and thus the developers can start creating Android Things based projects.
To support developers, we provide Wandboard PICO-iMX6UL Kit which is based on TechNexion HobbitFL carrier board and PICO-iMX6UL module.
HobbitFL board provides I/O connectors, expansion headers and mikroBUS™ socket. Ethernet PHY and audio codec IC is also placed on the board. Customization of carrier board is supported by freely available schematics, design files, board files and BOM lists; but the use of HobbitFL is more cost- effective solution for a small or medium series.
PICO-iMX6UL is based on a single-core 528MHz NXP i.MX6UL application processor combined with 512MB DDR3L RAM, 4GB eMMC and Wi-Fi 802.11bgn / Bluetooth LE 4.0 combo module. PICO-iMX6UL also provides USB 2.0 Host, USB OTG and 100Mbit RMII interfaces and low speed interfaces as UART, SPI, I2C etc.
TechNexion guarantees 12 year availability of modules and a revision control (4 years of active product development, 7 years of final product manufacture and 1 year of availability after the end of manufacture notice), which means that modules will be available until 2026 at least.
PICO-iMX6UL is available for commercial 0…60°C and extended -20…70°C ambient temperature range.
It uses proprietary 36x40mm form factor with three 70-pin expansion connectors on the bottom side and U.FL antenna connector on the top side. Provided heatsink is safely attached to the module using included screws, nuts and spacers.
• single-core ARM Cortex-A7, NXP i.MX6UL528MHz
• 512MB DDR3L RAM
• 4GB eMMC
• Wi-Fi 802.11bgn/Bluetooth LE 4.0
HobbitFL carrier board connectors and headers:
• RJ-45LAN connector
• USB 2.0 Host and USB OTG Type C connector
• CTIA compliant 3.5 mm audio jack (Line Out, Mic In)
• barrel jack for 5V power supply
• three expansion headers (18/24 bit TTL RGB, GPIO, SPI and I2C)
• mikroBUS™ socket (GPIO. UART, SPI, I2C, PWM, ADC)
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Date of publishing 03/29/2017. When you issue article on your website, please give its source: https://www.soselectronic.com/articles/technexion/explore-android-things-with-pico-imx6ul-kit-1955
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