Modules come with 12 year longevity TechNexion commitment and revision control (4 years of active product development, 7 years of final product manufacture and 1 year of availability after the end of manufacture notice), which means that modules will be available until 2026 at least.
Customization of carrier board is supported by freely available schematics, design files, board files and BOM lists; but the use of HobbitGL and NymphGL is more cost-effective solution for a small or medium series.
PICO-iMX6 modules are based on NXP ARM Cortex-A9 i.MX6 1, 2, or 4 core application processor combined with 512MB/1GB DDR3 RAM and 4GB eMMC or microSD card slot. Capacity of RAM can be increased up to 2GB and eMMC up to 64GB.
Modules have onboard Wi-Fi 802.11ac/Bluetooth LE 4.0 module (for commercial 0~60°C and extended -20~70°C temperature range), LVDS, HDMI, TTL RGB and MIPI DSI display interfaces, MIPI CSI camera interface, RGMII (Ethernet PHY IC is not included), x1 PCI-Express 2.0, SATA 2 (i.MX6 Quad only), USB Host, USB OTG, I2S, CAN, UART, SDIO, SPI, I2C, PWM and GPIO pins. Modules without Wi-Fi/Bluetooth are also available.
Modules use a closed format with the size of 36x40mm with three 70-pin expansion connectors on the bottom and U.FL antenna connector on the top. Provided heat sink is safely attached to module using the included screws, nuts and spacers.
Modules are manufactured for commercial 0~60°C, extended -20~70°C and industrial temperature range of -35~85°C. Certified extended and industrial range is also available, which means that each module is tested within this temperature range.