PICO-iMX6 - a powerful basis for your digital signage
PICO-iMX6 modules are members of compact, pin-compatible and long-term available platform with scalable performance optimized for digital signage, multimedia applications and panel computing.
Modules come with 12 year longevity TechNexion commitment and revision control (4 years of active product development, 7 years of final product manufacture and 1 year of availability after the end of manufacture notice), which means that modules will be available until 2026 at least.
Moduly PICO-iMX6 can be combined with HobbitGL carrier board, LVDS expander board and 7” 1024x600 TFT LCD kit with resistive touch panel. PICO-iMX6 module combined with NymphGL carrier board provide HDMI for external display and LVDS for internal TFT LCD panel like 7” 1024x600 TFT LCD panel kit with projective capacitive multi touch panel. Audio codec on both carrier boards provide LineOut and MicIn. Gbit Ethernet and onboard Wi-Fi 802.11ac/Bluetooth LE 4.0 provide seamless connectivity to Internet or local network.
Customization of carrier board is supported by freely available schematics, design files, board files and BOM lists; but the use of HobbitGL and NymphGL is more cost-effective solution for a small or medium series.
PICO-iMX6 modules are based on NXP ARM Cortex-A9 i.MX6 1, 2, or 4 core application processor combined with 512MB/1GB DDR3 RAM and 4GB eMMC or microSD card slot. Capacity of RAM can be increased up to 2GB and eMMC up to 64GB.
Modules have onboard Wi-Fi 802.11ac/Bluetooth LE 4.0 module (for commercial 0~60°C and extended -20~70°C temperature range), LVDS, HDMI, TTL RGB and MIPI DSI display interfaces, MIPI CSI camera interface, RGMII (Ethernet PHY IC is not included), x1 PCI-Express 2.0, SATA 2 (i.MX6 Quad only), USB Host, USB OTG, I2S, CAN, UART, SDIO, SPI, I2C, PWM and GPIO pins. Modules without Wi-Fi/Bluetooth are also available.
Modules use a closed format with the size of 36x40mm with three 70-pin expansion connectors on the bottom and U.FL antenna connector on the top. Provided heat sink is safely attached to module using the included screws, nuts and spacers.
Modules are manufactured for commercial 0~60°C, extended -20~70°C and industrial temperature range of -35~85°C. Certified extended and industrial range is also available, which means that each module is tested within this temperature range.
Modules come with source code (Linux kernel, u-boot, Android, Yocto Linux) and binary demo images (Android, Yocto Linux, Ubuntu Linux).
For further information about TechNexion products, please look at our TechNexion web pages or contact us at email@example.com.
- ARM Cortex-A9, NXP i.MX6 Solo/DualLite/Quad 1GHz
- RAM: Solo - 512MB DDR3 RAM, Dual, Quad – 1GB DDR3 RAM (up to 2GB available)
- Storage: 4GB eMMC, microSD slot (up to 64GB eMMC available)
- Wi-Fi 802.11ac/Bluetooth LE 4.0
- 1Gbit MAC, RGMII
- 1 x single channel 18/24 bit LVDS, 1 x HDMI version 1.4, 1 x 18/24 bit TTL RGB, 1 x dual lane MIPI DSI
- 1 x SATA 2 (i.MX6 Quad only)
- 1 x USB 2.0 Host, 1 x USB OTG
- 2 x I2S, 2 x CAN, 2 x UART, 1 x SDIO, 1 x SPI, 3 x I2C, 13 GPIO, 4 PWM